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Capacitive bypass |
Joel Kindem |
2011-04-19 |
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Capacitive bypass |
Joel Kindem |
2009-10-20 |
| 7417216 |
Fabrication of low leakage-current backside illuminated photodiodes |
Shulai Zhao, John Sheridan, Alan Mollet |
2008-08-26 |
| 7297927 |
Fabrication of low leakage-current backside illuminated photodiodes |
Shulai Zhao, John Sheridan, Alan Mollet |
2007-11-20 |
| 7256386 |
Fabrication of low leakage-current backside illuminated photodiodes |
Shulai Zhao, John Sheridan, Alan Mollet |
2007-08-14 |
| 7217953 |
Technique for suppression of edge current in semiconductor devices |
— |
2007-05-15 |
| 7019783 |
Charge pump power supply with noise control |
Joel Kindem |
2006-03-28 |
| 6798034 |
Technique for suppression of edge current in semiconductor devices |
— |
2004-09-28 |
| 6734416 |
Fabrication of low leakage-current backside illuminated photodiodes |
Shulai Zhao, John Sheridan, Alan Mollet |
2004-05-11 |
| 6677182 |
Technique for suppression of edge current in semiconductor devices |
— |
2004-01-13 |
| 6670258 |
Fabrication of low leakage-current backside illuminated photodiodes |
Shulai Zhao, John Sheridan, Alan Mollet |
2003-12-30 |
| 6630735 |
Insulator/metal bonding island for active-area silver epoxy bonding |
Shulai Zhao |
2003-10-07 |
| 6504178 |
Indirect back surface contact to semiconductor devices |
Shulai Zhao, Richard W. Wilson |
2003-01-07 |