Issued Patents All Time
Showing 1–25 of 48 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11682604 | Heat dissipation component and method for manufacturing same | Daisuke Goto, Yosuke Ishihara | 2023-06-20 |
| 11332623 | Carbon black, electrode catalyst and fuel cell using same, and method for producing carbon black | Makoto Uchida, Katsuyoshi KAKINUMA, Daiki IKEDA, Yusaku HARADA | 2022-05-17 |
| 11296008 | Aluminum-silicon carbide composite and production method therefor | Motonori Kino, Hideki Hirotsuru | 2022-04-05 |
| 10919811 | Aluminum-silicon-carbide composite and method of manufacturing same | Akimasa YUASA, Daisuke Goto | 2021-02-16 |
| 10869413 | Heat-dissipating component and method for manufacturing same | Motonori Kino | 2020-12-15 |
| 10751912 | Aluminum-diamond-based composite and method for producing same | Hiroaki Ota, Yosuke Ishihara | 2020-08-25 |
| 10640853 | Aluminum-diamond-based composite and heat dissipation component | Yosuke Ishihara, Hideo Tsukamoto, Kazunori KOYANAGI | 2020-05-05 |
| 10636723 | Heat dissipation component and method for manufacturing same | Daisuke Goto, Yosuke Ishihara | 2020-04-28 |
| 10541189 | Heat dissipation component for semiconductor element | Yosuke Ishihara, Hiroaki Ota, Hideo Tsukamoto | 2020-01-21 |
| 10539379 | Heat dissipation component for semiconductor element | Yosuke Ishihara, Kazunori KOYANAGI | 2020-01-21 |
| 10529591 | Method for producing silicon carbide composite material | Daisuke Goto | 2020-01-07 |
| 10424529 | Ceramic circuit board | Ryota Aono, Kosuke WADA, Masao TSUICHIHARA | 2019-09-24 |
| 10358704 | Composite body and method for manufacturing same | Yosuke Ishihara, Shinya Narita | 2019-07-23 |
| 10302375 | Aluminum-diamond composite, and heat dissipating component using same | Yosuke Ishihara, Hideo Tsukamoto, Shinya Narita | 2019-05-28 |
| 10081055 | Composite body and method for producing same | Hideki Hirotsuru | 2018-09-25 |
| 9872380 | Ceramic circuit board and method for producing same | Ryota Aono, Akimasa YUASA | 2018-01-16 |
| 9362192 | Semiconductor device comprising heat dissipating connector | Hajime Takagi | 2016-06-07 |
| 9275921 | Semiconductor device | — | 2016-03-01 |
| 9171817 | Semiconductor device | — | 2015-10-27 |
| 8796145 | Method of manufacturing metal-base substrate and method of manufacturing circuit board | Taiki Nishi, Katsunori Yashima, Kensuke Okoshi, Hidenori Ishikura | 2014-08-05 |
| 8449143 | Metal base circuit board | Kenji Miyata, Taiki Nishi, Yoshihiko Okajima | 2013-05-28 |
| 8440305 | Electrically conductive sheet | Yutaka Aoki | 2013-05-14 |
| 8426740 | Metal base circuit board | Taiki Nishi, Kiyokazu Yamazaki, Takashi Saiki | 2013-04-23 |
| 8148456 | Conductive resin composition and conductive sheets comprising the same | Yutaka Aoki | 2012-04-03 |
| 7832797 | Foldable furniture | — | 2010-11-16 |