Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10640853 | Aluminum-diamond-based composite and heat dissipation component | Yosuke Ishihara, Takeshi Miyakawa, Hideo Tsukamoto | 2020-05-05 |
| 10539379 | Heat dissipation component for semiconductor element | Yosuke Ishihara, Takeshi Miyakawa | 2020-01-21 |
| 10233125 | Aluminium-silicon carbide composite, and power-module base plate | Daisuke Goto, Hideki Hirotsuru, Yoshitaka Taniguchi, Goh Iwamoto | 2019-03-19 |