Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12303973 | Production method for aluminum-diamond composite | Hiroaki Ota, Daisuke Goto | 2025-05-20 |
| 11912489 | Package accommodating heat dissipation substrate and packing box | Hiroaki Ota, Daisuke Goto | 2024-02-27 |
| 11903168 | Heat dissipation member | Daisuke Goto | 2024-02-13 |
| 11682604 | Heat dissipation component and method for manufacturing same | Daisuke Goto, Takeshi Miyakawa | 2023-06-20 |
| 10751912 | Aluminum-diamond-based composite and method for producing same | Hiroaki Ota, Takeshi Miyakawa | 2020-08-25 |
| 10640853 | Aluminum-diamond-based composite and heat dissipation component | Takeshi Miyakawa, Hideo Tsukamoto, Kazunori KOYANAGI | 2020-05-05 |
| 10636723 | Heat dissipation component and method for manufacturing same | Daisuke Goto, Takeshi Miyakawa | 2020-04-28 |
| 10541189 | Heat dissipation component for semiconductor element | Takeshi Miyakawa, Hiroaki Ota, Hideo Tsukamoto | 2020-01-21 |
| 10539379 | Heat dissipation component for semiconductor element | Takeshi Miyakawa, Kazunori KOYANAGI | 2020-01-21 |
| 10358704 | Composite body and method for manufacturing same | Takeshi Miyakawa, Shinya Narita | 2019-07-23 |
| 10302375 | Aluminum-diamond composite, and heat dissipating component using same | Takeshi Miyakawa, Hideo Tsukamoto, Shinya Narita | 2019-05-28 |
| 9524918 | Heat dissipating component for semiconductor element | Hideki Hirotsuru, Hideo Tsukamoto | 2016-12-20 |
| 9387532 | Composite substrate for LED light emitting element, method of production of same, and LED light emitting element | Hideki Hirotsuru, Hideo Tsukamoto | 2016-07-12 |
| 9299888 | Clad material for LED light-emitting element holding substrate, and method for manufacturing same | Hideki Hirotsuru, Hideo Tsukamoto | 2016-03-29 |
| 8890189 | Wafer for LED mounting, method for manufacturing same, and LED-mounted structure using the wafer | Hideki Hirotsuru, Hideo Tsukamoto | 2014-11-18 |