Issued Patents All Time
Showing 1–25 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11296008 | Aluminum-silicon carbide composite and production method therefor | Takeshi Miyakawa, Motonori Kino | 2022-04-05 |
| 11094648 | Power module | Yoshitaka Taniguchi, Kohki Ichikawa, Atsushi Sakai | 2021-08-17 |
| 11096278 | Ceramic circuit board | Atsushi Sakai, Kohki Ichikawa, Yoshitaka Taniguchi | 2021-08-17 |
| 10615096 | Heat dissipation structure for electric circuit device | Toshitaka Yamagata, Saori INOUE, Ryoh Yoshimatu, Ryuji Koga | 2020-04-07 |
| 10487013 | Ceramic resin composite body | Taiki Nishi, Toshikatsu Mitsunaga, Saori INOUE | 2019-11-26 |
| 10377676 | Resin-impregnated boron nitride sintered body and use for same | Koki Ikarashi, Shuhei Nonaka, Toshikatsu Mitsunaga, Mitsuru Shiiba | 2019-08-13 |
| 10233125 | Aluminium-silicon carbide composite, and power-module base plate | Daisuke Goto, Yoshitaka Taniguchi, Goh Iwamoto, Kazunori KOYANAGI | 2019-03-19 |
| 10087112 | Resin-impregnated boron nitride sintered body and use for same | Koki Ikarashi, Shuhei Nonaka, Toshikatsu Mitsunaga, Mitsuru Shiiba | 2018-10-02 |
| 10081055 | Composite body and method for producing same | Takeshi Miyakawa | 2018-09-25 |
| 9879168 | Method for producing hexagonal boron nitride, and heat dissipation sheet | Junichi Tatami, Midori Sotokawa, Koki Ikarashi | 2018-01-30 |
| 9524918 | Heat dissipating component for semiconductor element | Hideo Tsukamoto, Yosuke Ishihara | 2016-12-20 |
| 9516741 | Boron nitride/resin composite circuit board, and circuit board including boron nitride/resin composite integrated with heat radiation plate | Shuhei Nonaka, Toshikatsu Mitsunaga, Koki Ikarashi, Kouji Miyata, Taiki Nishi +2 more | 2016-12-06 |
| 9387532 | Composite substrate for LED light emitting element, method of production of same, and LED light emitting element | Hideo Tsukamoto, Yosuke Ishihara | 2016-07-12 |
| 9299888 | Clad material for LED light-emitting element holding substrate, and method for manufacturing same | Yosuke Ishihara, Hideo Tsukamoto | 2016-03-29 |
| 9017824 | Aluminum-diamond composite and manufacturing method | Hideo Tsukamoto | 2015-04-28 |
| 8890189 | Wafer for LED mounting, method for manufacturing same, and LED-mounted structure using the wafer | Yosuke Ishihara, Hideo Tsukamoto | 2014-11-18 |
| 8883564 | Substrate comprising aluminum/graphite composite, heat dissipation part comprising same, and LED luminescent member | Satoshi Higuma, Shinya Narita, Yoshihiko Tsujimura | 2014-11-11 |
| 8546842 | LED chip assembly, LED package, and manufacturing method of LED package | Satoshi Higuma, Shinya Narita | 2013-10-01 |
| 8322398 | Manufacturing method of aluminum-diamond composite | Hideo Tsukamoto | 2012-12-04 |
| 8025962 | Aluminum-silicon carbide composite and heat dissipation device employing the same | Goh Iwamoto, Hideo Tsukamoto, Akira Miyai, Yoshio Sasaki | 2011-09-27 |
| 7993728 | Aluminum/silicon carbide composite and radiating part comprising the same | Goh Iwamoto, Hideo Tsukamoto, Satoshi Higuma, Nobuyuki Hashimoto | 2011-08-09 |
| 7838107 | Aluminum-silicon carbide composite | Goh Iwamoto, Kazunori Hirahara | 2010-11-23 |
| 7207105 | Method for producing an integral ceramic circuit board | Akira Miyai, Yukihiko Nakajima, Ryozo Nonogaki, Takuya Okada, Masahiro Ibukiyama | 2007-04-24 |
| 7130174 | Integral-type ceramic circuit board and method of producing same | Akira Miyai, Yukihiko Nakajima, Ryozo Nonogaki, Takuya Okada, Masahiro Ibukiyama | 2006-10-31 |
| 6447894 | Silicon carbide composite, method for producing it and heat dissipation device employing it | Kenji Nomura, Ryuichi Terasaki, Mitsuaki Saito, Kazuyuki Hiruta, Akira Miyai | 2002-09-10 |