Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12083784 | Temporary bonding body of ceramic resin composite and metal plate, method for producing same, object to be transported including the temporary bonding body, and method for transporting same | Yoshitaka MINAKATA, Toshitaka Yamagata, Saori INOUE, Ryo YOSHIMATU | 2024-09-10 |
| 11492299 | Nitride ceramic resin composite body | Yoshitaka MINAKATA, Eri Sasaki, Toshitaka Yamagata, Saori INOUE, Ryo YOSHIMATU | 2022-11-08 |
| 11034623 | Thermal conductive member and heat dissipation structure including the same | Saori INOUE, Toshitaka Yamagata, Yoshitaka MINAKATA, Ryo Yoshimatsu | 2021-06-15 |
| 10615096 | Heat dissipation structure for electric circuit device | Toshitaka Yamagata, Saori INOUE, Hideki Hirotsuru, Ryoh Yoshimatu | 2020-04-07 |
| 6469259 | Wiring board | Yoshihiro TAKESHITA, Shinya Terao, Satoru Takenouchi, Masaki Kaji | 2002-10-22 |
| 5172083 | Microwave plasma processing apparatus | Ryota Hidaka, Yoshinobu Kawai, Toru Yamaguchi | 1992-12-15 |