CI

Chikao Ikenaga

Dai Nippon Printing Co.: 57 patents #8 of 2,222Top 1%
ND Nitto Denko: 5 patents #655 of 2,479Top 30%
AC Alps Electric Co.: 1 patents #1,191 of 2,177Top 55%
Overall (All Time): #42,390 of 4,157,543Top 2%
57
Patents All Time

Issued Patents All Time

Showing 26–50 of 57 patents

Patent #TitleCo-InventorsDate
11118258 Deposition mask, method of manufacturing deposition mask and metal plate Yo Shimazaki, Kentarou Seki, Hiroki Furushou, Chiaki Hatsuta 2021-09-14
10991883 Deposition mask, method of manufacturing deposition mask device, and method of manufacturing deposition mask 2021-04-27
10731261 Metal plate, method of manufacturing metal plate, and method of manufacturing mask by use of metal plate Isao MIYATANI 2020-08-04
10612124 Manufacturing method for deposition mask, metal plate used for producing deposition mask, and manufacturing method for said metal sheet Hiroaki Nakayama, Kazunari Ikeda, Chiaki Hatsuta, Utako Oouchi 2020-04-07
10600963 Metal plate, method of manufacturing metal plate, and method of manufacturing mask by using metal plate 2020-03-24
10570498 Manufacturing method for deposition mask, metal plate used for producing deposition mask, and manufacturing method for said metal sheet Hiroaki Nakayama, Kazunari Ikeda, Chiaki Hatsuta, Utako Oouchi 2020-02-25
10541387 Deposition mask, method of manufacturing deposition mask and metal plate Yo Shimazaki, Kentarou Seki, Hiroki Furushou, Chiaki Hatsuta 2020-01-21
10538838 Deposition mask, method of manufacturing deposition mask and metal plate Yo Shimazaki, Kentarou Seki, Hiroki Furushou, Chiaki Hatsuta 2020-01-21
10233546 Metal plate, method of manufacturing metal plate, and method of manufacturing mask by use of metal plate Isao MIYATANI 2019-03-19
10126521 Leaf spring, camera module drive mechanism, electronic terminal, and method for producing leaf spring Yoshihiko Ogino, Takahiro Sahara, Masahiro Nagata 2018-11-13
9828665 Metal plate, method of manufacturing metal plate, and method of manufacturing deposition mask by use of metal plate Isao MIYATANI 2017-11-28
9806241 Resin-attached lead frame and semiconductor device Kazunori Oda 2017-10-31
9461220 Resin-attached lead frame, method for manufacturing the same, and lead frame Kazunori Oda 2016-10-04
8653647 Plastic package and method of fabricating the same Masachika Masuda 2014-02-18
8525351 Semiconductor device, substrate for producing semiconductor device and method of producing them Kentarou Seki, Kazuhito Hosokawa, Takuji Okeyui, Keisuke Yoshikawa, Kazuhiro Ikemura 2013-09-03
8018044 Semiconductor device, substrate for producing semiconductor device and method of producing them Kentarou Seki, Kazuhito Hosokawa, Takuji Okeyui, Keisuke Yoshikawa, Kazuhiro Ikemura 2011-09-13
7947598 Substrate for semiconductor device, resin-sealed semiconductor device, method for manufacturing said substrate for semiconductor device and method for manufacturing said resin-sealed semiconductor device Shozo Ishikawa 2011-05-24
7943427 Semiconductor device, substrate for producing semiconductor device and method of producing them Kentarou Seki, Kazuhito Hosokawa, Takuji Okeyui, Keisuke Yoshikawa, Kazuhiro Ikemura 2011-05-17
7851902 Resin-sealed semiconductor device, manufacturing method thereof, base material for the semiconductor device, and layered and resin-sealed semiconductor device Masachika Masuda, Koji Tomita 2010-12-14
7825514 Substrate for semiconductor device, resin-sealed semiconductor device, method for manufacturing said substrate for semiconductor device and method for manufacturing said resin-sealed semiconductor device Shozo Ishikawa 2010-11-02
7405468 Plastic package and method of fabricating the same Masachika Masuda 2008-07-29
7365441 Semiconductor device fabricating apparatus and semiconductor device fabricating method You Shimazaki, Masachika Masuda, Kazuhito Hosokawa, Takuji Okeyui, Keisuke Yoshikawa +1 more 2008-04-29
7271471 Metal substrate apparatus, method of manufacturing an IC card module apparatus, and an IC card module apparatus Masachika Masuda 2007-09-18
7247515 Frame for semiconductor package Kouji Tomita 2007-07-24
7064011 Semiconductor device fabricating apparatus and semiconductor device fabricating method You Shimazaki, Masachika Masuda, Kazuhito Hosokawa, Takuji Okeyui, Keisuke Yoshikawa +1 more 2006-06-20