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Aluminum-filled via structure with barrier layer |
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2005-12-20 |
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Method for forming a metallization structure in an integrated circuit |
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2005-11-29 |
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Method of forming a low resistivity Ti-containing interconnect and semiconductor device comprising the same |
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2005-06-14 |
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Metal stack for local interconnect layer |
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2004-08-10 |
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Low temperature metallization process |
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2004-06-29 |
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Method of forming metal layer(s) and/or antireflective coating layer(s) on an integrated circuit |
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2003-03-18 |
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Method for forming void-free metallization in an integrated circuit |
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2002-09-24 |
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Method of forming metal layer(s) and/or antireflective coating layer(s) on an integrated circuit |
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2001-02-13 |
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Low temperature metallization process |
Ende Shan, Sam Geha |
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