Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6906421 | Method of forming a low resistivity Ti-containing interconnect and semiconductor device comprising the same | Gorley Lau, Anthony Chung | 2005-06-14 |
| 6756302 | Low temperature metallization process | Gorley Lau, Sam Geha | 2004-06-29 |
| 6746950 | Low temperature aluminum planarization process | — | 2004-06-08 |
| 6534398 | Method of forming metal layer(s) and/or antireflective coating layer(s) on an integrated circuit | Gorley Lau, Sam Geha | 2003-03-18 |
| 6187667 | Method of forming metal layer(s) and/or antireflective coating layer(s) on an integrated circuit | Gorley Lau, Sam Geha | 2001-02-13 |
| 6156645 | Method of forming a metal layer on a substrate, including formation of wetting layer at a high temperature | Sam Geha | 2000-12-05 |
| 6140228 | Low temperature metallization process | Gorley Lau, Sam Geha | 2000-10-31 |
| 5968851 | Controlled isotropic etch process and method of forming an opening in a dielectric layer | Sam Geha | 1999-10-19 |