Issued Patents All Time
Showing 126–150 of 154 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7681759 | Fluid-dispensing apparatus with controlled tear-off | — | 2010-03-23 |
| 7638013 | Systems for assembling components on submounts and methods therefor | Norbert Hiller, David B. Slater, Jr., Gerald H. Negley | 2009-12-29 |
| 7623252 | Methods, apparatus and computer program products for controlling a volume of liquid in semiconductor processing based on reflected optical radiation | Gerald H. Negley | 2009-11-24 |
| 7611915 | Methods of manufacturing light emitting diodes including barrier layers/sublayers | David B. Slater, Jr., Bradley E. Williams, John Edmond, Scott Allen | 2009-11-03 |
| 7612383 | Reflector packages and semiconductor light emitting devices including the same | Thomas G. Coleman, James Ibbetson, Michael Leung, Gerald H. Negley, Eric Tarsa | 2009-11-03 |
| 7608860 | Light emitting devices suitable for flip-chip bonding | David B. Slater, Jr., Jayesh Bharathan, John Edmond, Mark Raffetto, Anwar Mohammed +1 more | 2009-10-27 |
| D591697 | Lamp package | Nicholas W. Medendorp, Jr. | 2009-05-05 |
| 7521728 | Packages for semiconductor light emitting devices utilizing dispensed reflectors and methods of forming the same | — | 2009-04-21 |
| 7518158 | Semiconductor light emitting devices and submounts | Bernd Keller, James Ibbetson, Gerald H. Negley, Norbert Hiller | 2009-04-14 |
| 7442564 | Dispensed electrical interconnections | — | 2008-10-28 |
| 7405094 | Light emitting devices for light conversion and methods and semiconductor chips for fabricating the same | — | 2008-07-29 |
| 7405093 | Methods of assembly for a semiconductor light emitting device package | — | 2008-07-29 |
| 7368756 | Trench cut light emitting diodes and methods of fabricating same | Michael T. Bruhns, Brad Williams, Jeff LaHaye | 2008-05-06 |
| 7365371 | Packages for semiconductor light emitting devices utilizing dispensed encapsulants | — | 2008-04-29 |
| 7341175 | Bonding of light emitting diodes having shaped substrates | David B. Slater, Jr., Jayesh Bharathan, John Edmond, Mark Raffetto, Anwar Mohammed +1 more | 2008-03-11 |
| 7326583 | Methods for packaging of a semiconductor light emitting device | Thomas G. Coleman, James Ibbetson, Michael Leung, Gerald H. Negley, Eric Tarsa | 2008-02-05 |
| 7279346 | Method for packaging a light emitting device by one dispense then cure step followed by another | Thomas G. Coleman, James Ibbetson, Michael Leung, Gerald H. Negley, Eric Tarsa | 2007-10-09 |
| 7259033 | Flip-chip bonding of light emitting devices | David B. Slater, Jr., Jayesh Bharathan, John Edmond, Mark Raffetto, Anwar Mohammed +1 more | 2007-08-21 |
| 7244965 | Power surface mount light emitting die package | Ban P. Loh | 2007-07-17 |
| 7211833 | Light emitting diodes including barrier layers/sublayers | David B. Slater, Jr., Bradley E. Williams, John Edmond, Scott Allen | 2007-05-01 |
| 7147739 | Systems for assembling components on submounts and methods therefor | Norbert Hiller, David B. Slater, Jr., Gerald H. Negley | 2006-12-12 |
| 7037742 | Methods of fabricating light emitting devices using mesa regions and passivation layers | David B. Slater, Jr., Bradley E. Williams | 2006-05-02 |
| 7008861 | Semiconductor substrate assemblies and methods for preparing and dicing the same | Elbert Brown, Gerald H. Negley | 2006-03-07 |
| 6995032 | Trench cut light emitting diodes and methods of fabricating same | Michael T. Bruhns, Brad Williams, Jeff LaHaye | 2006-02-07 |
| 6888167 | Flip-chip bonding of light emitting devices and light emitting devices suitable for flip-chip bonding | David B. Slater, Jr., Jayesh Bharathan, John Edmond, Mark Raffetto, Anwar Mohammed +1 more | 2005-05-03 |