| 11545597 |
Fabrication for precise line-bond control and gas diffusion between LED components |
Daniel Roitman |
2023-01-03 |
|
| 11233175 |
Precise bondline control between LED components |
Daniel Roitman, Sujan-Ehsan Wadud, William David Collins, III, Darren Dunphy, Prashant Singh |
2022-01-25 |
|
| 10600937 |
Precise bondline control between LED components |
Daniel Roitman, Sujan-Ehsan Wadud, William David Collins, III, Darren Dunphy, Prashant Singh |
2020-03-24 |
|
| 9627361 |
Multiple configuration light emitting devices and methods |
Peter Scott Andrews, Raymond Rosado, David T. Emerson, Jeffrey Carl Britt |
2017-04-18 |
$4,402,000 |
| 9515055 |
Light emitting devices including multiple anodes and cathodes |
Jeffrey Carl Britt, Brandon Stanton |
2016-12-06 |
$2,897,000 |
| 9142663 |
Silicon carbide devices having smooth channels |
Mrinal K. Das |
2015-09-22 |
$2,694,000 |
| 9041042 |
High density multi-chip LED devices |
Peter Scott Andrews, Raymond Rosado, David T. Emerson, Amber C. Abare, Jeffrey Carl Britt |
2015-05-26 |
$3,140,000 |
| 8859366 |
Methods of fabricating silicon carbide devices having smooth channels |
Mrinal K. Das |
2014-10-14 |
$5,893,000 |
| D713804 |
Light emitting diode (LED) package with multiple anodes and cathodes |
Jeffrey Carl Britt, Brandon Stanton |
2014-09-23 |
|
| D712849 |
Light emitting diode (LED) package with multiple anodes and cathodes |
Jeffrey Carl Britt, Brandon Stanton |
2014-09-09 |
|
| D711841 |
Light emitting diode (LED) package |
Jeffrey Carl Britt |
2014-08-26 |
|
| 8696159 |
Multi-chip LED devices |
Peter Scott Andrews, Raymond Rosado, David T. Emerson, Jeffrey Carl Britt |
2014-04-15 |
$13,870,000 |
| 8188483 |
Silicon carbide devices having smooth channels |
Mrinal K. Das |
2012-05-29 |
$17,436,000 |
| D660257 |
Emitter package |
Peter Scott Andrews, Raymond Rosado, David T. Emerson, Jeffrey Carl Britt |
2012-05-22 |
|
| D658139 |
High-density emitter package |
Peter Scott Andrews, Raymond Rosado, David T. Emerson, Amber C. Abare, Jeffrey Carl Britt |
2012-04-24 |
|
| D650343 |
Multiple configuration light emitting device package |
Peter Scott Andrews, Raymond Rosado, David T. Emerson, Jeffrey Carl Britt |
2011-12-13 |
|
| 7943952 |
Method of uniform phosphor chip coating and LED package fabricated using method |
Ban P. Loh, Nicholas W. Medendorp, Jr., Peter Scott Andrews, Yankun Fu, Ronan P. LeToquin |
2011-05-17 |
$7,262,000 |
| 7528040 |
Methods of fabricating silicon carbide devices having smooth channels |
Mrinal K. Das |
2009-05-05 |
$29,930,000 |
| 7422634 |
Three inch silicon carbide wafer with low warp, bow, and TTV |
Adrian Powell, William H. Brixius, Robert Tyler Leonard, Davis Andrew McClure |
2008-09-09 |
$25,624,000 |
| 7393790 |
Method of manufacturing carrier wafer and resulting carrier wafer structures |
Jeffrey Carl Britt, Craig William Hardin |
2008-07-01 |
$26,026,000 |
| 6054078 |
Integrally bonded, multilayer foamed product |
Eduardo Lauer, Michael W. Allman |
2000-04-25 |
|
| 5904970 |
Integrally bonded, multilayer foamed product |
Eduardo Lauer, Michael W. Allman |
1999-05-18 |
|
| 5306771 |
High rubber graft thermoplastic composition with improved mechanical properties prepared by melt blending |
Marinus E. J. Dekkers, James J. Scobbo, Jr., Robert Halley, Ronald L. Jalbert |
1994-04-26 |
$10,463,000 |
| 5264487 |
Compositions derived from recycled polymers |
James J. Scobbo, Jr., Marinus E. J. Dekkers |
1993-11-23 |
$11,447,000 |
| 5258455 |
Polyphenylene ether-olefin polymer compositions with improved properties |
James J. Scobbo, Jr., Marinus E. J. Dekkers |
1993-11-02 |
$10,431,000 |
