Issued Patents All Time
Showing 26–50 of 55 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9895711 | Substrate liquid processing apparatus, substrate liquid processing method and substrate processing apparatus | Yoshifumi Amano, Eiichiro Okamoto, Yuki Ito | 2018-02-20 |
| 9833433 | Compositions, methods of use, and methods of treatment | Chu Chen | 2017-12-05 |
| 9763912 | Compositions, methods of use, and methods of treatment | Chu Chen | 2017-09-19 |
| 9724727 | Methods for printing on glass | Jeffrey John Domey, Matthew Wade Fenton, Govindarajan Natarajan, Paul John Shustack | 2017-08-08 |
| 9629258 | Reflow treating unit and substrate treating apparatus | — | 2017-04-18 |
| 9572266 | Reflow treating unit and substrate treating apparatus | — | 2017-02-14 |
| 9393981 | Foldable cart with rear guidance arrangement | Chunghsin Lee | 2016-07-19 |
| 9226407 | Reflow treating unit and substrate treating apparatus | — | 2015-12-29 |
| 8955870 | Tracking foldable cart | Chunghsin Lee | 2015-02-17 |
| 8789638 | Foldable cart with tracking arrangement | Chunghsin Lee | 2014-07-29 |
| 8640591 | Transparent armor with improved multi-hit performance by use of a thin cover glass | Leonard Charles Dabich, II, Huan-Hung Sheng, Steven Alvin Tietje, Parimal J. Patel | 2014-02-04 |
| 8524593 | Arrangement for solder bump formation on wafers | Chunghsin Lee | 2013-09-03 |
| 8274161 | Flux-free chip to substrate joint serial linear thermal processor arrangement | Chunghsin Lee | 2012-09-25 |
| 8252678 | Flux-free chip to wafer joint serial thermal processor arrangement | — | 2012-08-28 |
| 8161862 | Hybrid laminated transparent armor | Linda Ruth Pinckney | 2012-04-24 |
| 7982320 | Arrangement for solder bump formation on wafers | Chunghsin Lee | 2011-07-19 |
| 7875565 | Transparent glass-ceramic armor | Linda Ruth Pinckney, Carl F. Cline | 2011-01-25 |
| 7822249 | Systems and methods for high-throughput radiation biodosimetry | Guy Garty, David Jonathan Brenner, Gerhard Randers-Pehrson, Y. Lawrence Yao, Nabil Simaan +4 more | 2010-10-26 |
| 7787681 | Systems and methods for robotic transport | Alessio Salerno, Nabil Simaan, Y. Lawrence Yao, Gerhard Randers-Pehrson, Guy Garty +2 more | 2010-08-31 |
| 7632750 | Arrangement for solder bump formation on wafers | Chunghsin Lee | 2009-12-15 |
| 7416969 | Void free solder arrangement for screen printing semiconductor wafers | — | 2008-08-26 |
| 7358175 | Serial thermal processor arrangement | Chunghsin Lee | 2008-04-15 |
| 7108470 | Buffer device for semiconductor processing apparatus | Wee How, Hong Yang Tim Wong | 2006-09-19 |
| 7008879 | Isolation chamber arrangement for serial processing of semiconductor wafers for the electronic industry | Chunghsin Lee, Darren M. Simonelli, Keith D. Mullins, David A. Wassen | 2006-03-07 |
| 6827789 | Isolation chamber arrangement for serial processing of semiconductor wafers for the electronic industry | Chunghsin Lee, Darren M. Simonelli, Keith D. Mullius, David A. Wassen | 2004-12-07 |