Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11602908 | Method of mesh generation for resin transfer molding process | Chien-Ting Wu, Hsun YANG, Li-Hsuan Shen, Chih-Chung Hsu, Chia-Hsiang Hsu +1 more | 2023-03-14 |
| 11521903 | Method of measuring voids in underfill package | Chien-Ting Wu, Kai Bai, Wei Yu Lin, Li-Hsuan Shen, Chia-Peng Sun +3 more | 2022-12-06 |