Method of measuring voids in underfill package

Assignee

• Coretech System Co.

Inventors

• Chien-Ting Wu (4 patents)
• Ching-Kai Chou (2 patents)
• Kai Bai (2 patents)
• Wei Yu Lin (3 patents)
• Li-Hsuan Shen (3 patents)
• Chia-Peng Sun (2 patents)
• Chih-Chung Hsu (20 patents)
• Rong-Yeu Chang (46 patents)
• Chia-Hsiang Hsu (63 patents)

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