Issued Patents All Time
Showing 25 most recent of 63 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12418088 | Signal transmitting device | — | 2025-09-16 |
| 12235614 | Molding system for fabricating fiber reinforcement polymer composite article and molding method thereof | Chi-Hua Yu, Mao-Ken Hsu, Yi-Wen Chen, Li-Hsuan Shen, Chih-Chung Hsu +1 more | 2025-02-25 |
| 11881453 | Method for preparing a semiconductor device with interconnect part | — | 2024-01-23 |
| 11876000 | Method for preparing semiconductor device structure with patterns having different heights | — | 2024-01-16 |
| D1003928 | Display screen or portion thereof with graphical user interface | Cheng-Kuang Lee, Chen Wang, Rong-Yeu Chang | 2023-11-07 |
| 11764105 | Method for preparing semiconductor device structure with multiple liners | — | 2023-09-19 |
| 11742286 | Semiconductor device with interconnect part and method for forming the same | — | 2023-08-29 |
| 11602908 | Method of mesh generation for resin transfer molding process | Ching-Kai Chou, Chien-Ting Wu, Hsun YANG, Li-Hsuan Shen, Chih-Chung Hsu +1 more | 2023-03-14 |
| 11594447 | Semiconductor device structure with multiple liners and method for forming the same | — | 2023-02-28 |
| 11521903 | Method of measuring voids in underfill package | Chien-Ting Wu, Ching-Kai Chou, Kai Bai, Wei Yu Lin, Li-Hsuan Shen +3 more | 2022-12-06 |
| 11407156 | Molding system for preparing an injection-molded article | Huan-Chang Tseng, Rong-Yeu Chang | 2022-08-09 |
| 11376776 | Method of measuring true shear viscosity profile of molding material in capillary and molding system performing the same | Chen Wang, Yu-Ho Wen, Guo-Sian Cyue, Chih-Chung Hsu, Rong-Yeu Chang | 2022-07-05 |
| 11378505 | Method of measuring extensional viscosity of polymer melts and capillary injection system | Huan-Chang Tseng, Rong-Yeu Chang | 2022-07-05 |
| 11376777 | Molding system for preparing molded article with orientation effect | Huan-Chang Tseng, Rong-Yeu Chang | 2022-07-05 |
| 11355435 | Semiconductor device with air gaps | — | 2022-06-07 |
| 11355361 | Method of measuring underfill profile of underfill cavity having solder bumps | Yu-En Liang, Chia-Peng Sun, Chih-Chung Hsu, Rong-Yeu Chang | 2022-06-07 |
| 11309313 | Semiconductor device with landing pad of conductive polymer and method for fabricating the same | — | 2022-04-19 |
| 11230044 | Method of setting pressure profile of injection-molding apparatus | Rong-Yeu Chang, Yuing Chang, Ting-Yu Cheng | 2022-01-25 |
| 11230043 | Method for setting molding conditions of injection-molding equipment | Rong-Yeu Chang, Chuan-Wei Chang | 2022-01-25 |
| 11225005 | System for setting molding conditions of injection-molding equipment | Rong-Yeu Chang, Chuan-Wei Chang | 2022-01-18 |
| 11065795 | Molding system for preparing thermoplastic composite article | Huan-Chang Tseng, Rong-Yeu Chang | 2021-07-20 |
| 11027470 | Molding system for preparing injuection-molded article | Huan-Chang Tseng, Rong-Yeu Chang | 2021-06-08 |
| 10987844 | Clamping mechanism assembly | Yuing Chang, Chih-Kang Lee, Rong-Yeu Chang | 2021-04-27 |
| 10960592 | Computer-implemented simulation method for injection-molding process | Chih-Chung Hsu, You Zhou, Rong-Yeu Chang | 2021-03-30 |
| 10946597 | Method for measuring a flowing property in a resin transfer molding system | Yuan Yao, Tzu-Heng CHIU, Rong-Yeu Chang, Chih-Wei Wang, Shih-Po Sun +3 more | 2021-03-16 |