Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
ZY

Zhiping Yang — 21 Patents

Cisco: 11 patents #1,278 of 13,007Top 10%
Apple: 7 patents #4,315 of 18,612Top 25%
Google: 1 patents #14,887 of 22,993Top 65%
Overall (All Time): #201,324 of 4,157,543Top 5%
21 Patents All Time
Zhiping Yang has been granted 21 US patents while listed as an inventor at Cisco. The first was granted in 2006 and the most recent in April 2025. Zhiping Yang ranks #201,324 of 4,157,543 US inventors in our database (top 4.8%). Patent records list Zhiping Yang in Shantou, CA, CN.

Patents per Year

Patents granted per year, 2006 to 2025Bar chart with a peak of 3 patents in 2007.peak 32006: 1 patents20062007: 3 patents2008: 1 patents20082009: 1 patents2010: 1 patents20102011: 1 patents2014: 1 patents20142015: 2 patents2016: 2 patents20162017: 2 patents2018: 1 patents20182019: 1 patents2020: 1 patents20202022: 1 patents2025: 2 patents2025

Issued Patents All Time

Showing 1–21 of 21 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
D1071566 Cleansing brush 2025-04-22
D1064405 Automatic curling iron 2025-02-25
11329414 Conductive receptacle collar for desense mitigation Yichi Zhang, Songping Wu, Shuai Jin, Huan Liao 2022-05-10 $89,066,000
10628654 Capacitive sensing array having electrical isolation Hanfeng Wang 2020-04-21 $110,357,000
10296773 Capacitive sensing array having electrical isolation Hanfeng Wang 2019-05-21 $75,437,000
10002101 Methods and apparatus for equalization of a high speed serial bus Songping Wu, Kirill Kalinichev, Greg Nayman, Georgi Beloev 2018-06-19 $127,515,000
9853016 Systems and methods for high-speed, low-profile memory packages and pinout designs Anthony Fai, Evan R. Boyle, Zhonghua Wu 2017-12-26 $58,651,000
9583452 Systems and methods for high-speed, low-profile memory packages and pinout designs Anthony Fai, Evan R. Boyle, Zhonghua Wu 2017-02-28 $61,357,000
9466571 Systems and methods for high-speed, low-profile memory packages and pinout designs Anthony Fai, Evan R. Boyle, Zhonghua Wu 2016-10-11 $94,888,000
9414497 Semiconductor package including an embedded circuit component within a support structure of the package Jovica Savic, Jie Xue, Li Li 2016-08-09 $21,562,000
9129908 Manufacturing a semiconductor package including an embedded circuit component within a support structure of the package Jovica Savic, Jie Xue, Li Li 2015-09-08 $28,347,000
9087846 Systems and methods for high-speed, low-profile memory packages and pinout designs Anthony Fai, Evan R. Boyle, Zhonghua Wu 2015-07-21 $90,600,000
8727793 Optical module design in an SFP form factor to support increased rates of data transmission Luca Cafiero, Victor Odisho, Francisco M. Matus 2014-05-20 $26,471,000
7924911 Techniques for simulating a decision feedback equalizer circuit 2011-04-12 $33,628,000
7675147 Methods and apparatus for providing a power signal to an area array package Kenneth Hubbard, Jie Xue, Yida Zou 2010-03-09 $34,761,000
7486702 DDR interface for reducing SSO/SSI noise 2009-02-03 $34,262,000
7360307 Techniques for manufacturing a circuit board with an improved layout for decoupling capacitors Vinayagam Arumugham, Lekhanh Dang 2008-04-22 $50,196,000
7303941 Methods and apparatus for providing a power signal to an area array package Kenneth Hubbard, Jie Xue, Yida Zou 2007-12-04 $68,277,000
7262974 Techniques for alleviating the need for DC blocking capacitors in high-speed differential signal pairs Vinayagam Arumugham 2007-08-28 $319,924,000
7254032 Techniques for providing EMI shielding within a circuit board component Jie Xue, Yida Zou 2007-08-07 $136,685,000
6992374 Techniques for manufacturing a circuit board with an improved layout for decoupling capacitors Vinayagam Arumugham, Lekhanh Dang 2006-01-31 $66,789,000