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Cleansing brush |
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Automatic curling iron |
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Conductive receptacle collar for desense mitigation |
Yichi Zhang, Songping Wu, Shuai Jin, Huan Liao |
2022-05-10 |
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Capacitive sensing array having electrical isolation |
Hanfeng Wang |
2020-04-21 |
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Capacitive sensing array having electrical isolation |
Hanfeng Wang |
2019-05-21 |
| 10002101 |
Methods and apparatus for equalization of a high speed serial bus |
Songping Wu, Kirill Kalinichev, Greg Nayman, Georgi Beloev |
2018-06-19 |
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Systems and methods for high-speed, low-profile memory packages and pinout designs |
Anthony Fai, Evan R. Boyle, Zhonghua Wu |
2017-12-26 |
| 9583452 |
Systems and methods for high-speed, low-profile memory packages and pinout designs |
Anthony Fai, Evan R. Boyle, Zhonghua Wu |
2017-02-28 |
| 9466571 |
Systems and methods for high-speed, low-profile memory packages and pinout designs |
Anthony Fai, Evan R. Boyle, Zhonghua Wu |
2016-10-11 |
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Semiconductor package including an embedded circuit component within a support structure of the package |
Jovica Savic, Jie Xue, Li Li |
2016-08-09 |
| 9129908 |
Manufacturing a semiconductor package including an embedded circuit component within a support structure of the package |
Jovica Savic, Jie Xue, Li Li |
2015-09-08 |
| 9087846 |
Systems and methods for high-speed, low-profile memory packages and pinout designs |
Anthony Fai, Evan R. Boyle, Zhonghua Wu |
2015-07-21 |
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Optical module design in an SFP form factor to support increased rates of data transmission |
Luca Cafiero, Victor Odisho, Francisco M. Matus |
2014-05-20 |
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Techniques for simulating a decision feedback equalizer circuit |
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2011-04-12 |
| 7675147 |
Methods and apparatus for providing a power signal to an area array package |
Kenneth Hubbard, Jie Xue, Yida Zou |
2010-03-09 |
| 7486702 |
DDR interface for reducing SSO/SSI noise |
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2009-02-03 |
| 7360307 |
Techniques for manufacturing a circuit board with an improved layout for decoupling capacitors |
Vinayagam Arumugham, Lekhanh Dang |
2008-04-22 |
| 7303941 |
Methods and apparatus for providing a power signal to an area array package |
Kenneth Hubbard, Jie Xue, Yida Zou |
2007-12-04 |
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Techniques for alleviating the need for DC blocking capacitors in high-speed differential signal pairs |
Vinayagam Arumugham |
2007-08-28 |
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Techniques for providing EMI shielding within a circuit board component |
Jie Xue, Yida Zou |
2007-08-07 |
| 6992374 |
Techniques for manufacturing a circuit board with an improved layout for decoupling capacitors |
Vinayagam Arumugham, Lekhanh Dang |
2006-01-31 |