Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Techniques for manufacturing a circuit board with an improved layout for decoupling capacitors

Techniques for manufacturing a circuit board with an improved layout for decoupling capacitors

US Patent 6992374 · Granted Jan 31, 2006

Estimated economic value: $66,789,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Cleansing brush2025
Automatic curling iron2025
Conductive receptacle collar for desense mitigation2022
Capacitive sensing array having electrical isolation2020
Capacitive sensing array having electrical isolation2019
Methods and apparatus for equalization of a high speed serial bus2018
Systems and methods for high-speed, low-profile memory packages and pinout desig2017
Systems and methods for high-speed, low-profile memory packages and pinout desig2017
Systems and methods for high-speed, low-profile memory packages and pinout desig2016
Semiconductor package including an embedded circuit component within a support s2016
Manufacturing a semiconductor package including an embedded circuit component wi2015
Systems and methods for high-speed, low-profile memory packages and pinout desig2015