Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7675147 | Methods and apparatus for providing a power signal to an area array package | Kenneth Hubbard, Jie Xue, Zhiping Yang | 2010-03-09 |
| 7303941 | Methods and apparatus for providing a power signal to an area array package | Kenneth Hubbard, Jie Xue, Zhiping Yang | 2007-12-04 |
| 7254032 | Techniques for providing EMI shielding within a circuit board component | Jie Xue, Zhiping Yang | 2007-08-07 |
| 7185821 | Method and apparatus for delivering high-current power and ground voltages using top side of chip package substrate | Sergio Camerlo, Luca Cafiero, Gary L. Myers, Bobby Parizi, Hsing-Sheng Liang | 2007-03-06 |
| 6914780 | Methods and apparatus for cooling a circuit board component using a heat pipe assembly | Bangalore J. Shanker, Sergio Camerlo | 2005-07-05 |
| 6621705 | Miniature surface mount heatsink element and method of use | Robert Ballenger, David Popovich | 2003-09-16 |