Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7185821 | Method and apparatus for delivering high-current power and ground voltages using top side of chip package substrate | Sergio Camerlo, Yida Zou, Luca Cafiero, Gary L. Myers, Hsing-Sheng Liang | 2007-03-06 |
| 6501030 | Grounding plug for printed circuit board | Nguyen Nguyen, Saeed Seyedarab, Toan Nguyen | 2002-12-31 |
| 6385053 | PCB vertical and horizontal guide | Nguyen Nguyen, Michael Chern, Saeed Seyedarab | 2002-05-07 |