Assignee
Inventors
- Jovica Savic (24 patents)
- Zhiping Yang (21 patents)
- Jie Xue (21 patents)
- Li Li (16 patents)
{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Manufacturing a semiconductor package including an embedded circuit component within a support structure of the package", "item": "https://www.patentleaderboard.com/patent/9129908"}]}
Skip to contentUS Patent 9129908 · Granted Sep 8, 2015