Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12057379 | Optimized power delivery for multi-layer substrate | D. Brice Achkir, Jie Xue | 2024-08-06 |
| 11650247 | Multiple sense points for addressing a voltage gradient | Jerrold Mark Pianin, Joel Richard Goergen | 2023-05-16 |
| 11564317 | Integrated power delivery board for delivering power to an ASIC with bypass of signal vias in a printed circuit board | Kan Chiu Seto, Straty Argyrakis, Joel Richard Goergen, Paul Lachlan Mantiply, Richard Anthony O'Brien | 2023-01-24 |
| 11252811 | Power distribution from point-of-load with cooling | Joel Richard Goergen, Jessica Kiefer, Ashley Julia Maker Erickson, Yi Tang, M. Baris Dogruoz +1 more | 2022-02-15 |
| 10999930 | Integrated power delivery board for delivering power to an ASIC with bypass of signal vias in a printed circuit board | Kan Chiu Seto, Straty Argyrakis, Joel Richard Goergen, Paul Lachlan Mantiply, Richard Anthony O'Brien | 2021-05-04 |
| 10068721 | Hot swap circuit | Michael Robert Grant, Yang Li, Jessica Kiefer, Kan Chiu Seto | 2018-09-04 |
| 9665164 | Hot swap circuit | Michael Robert Grant, Yang Li, Jessica Kiefer, Kan Chiu Seto | 2017-05-30 |
| 6171737 | Low cost application of oxide test wafer for defect monitor in photolithography process | Khoi A. Phan, Robert J. Chiu, Bhanwar Singh | 2001-01-09 |