Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6566650 | Incorporation of dielectric layer onto SThM tips for direct thermal analysis | Kin Leong Pey, Yung Fu Chong, Chim Wai Kin, Pavel Neuzil, Lap Chan | 2003-05-20 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6566650 | Incorporation of dielectric layer onto SThM tips for direct thermal analysis | Kin Leong Pey, Yung Fu Chong, Chim Wai Kin, Pavel Neuzil, Lap Chan | 2003-05-20 |