| 7306637 |
Anionic abrasive particles treated with positively charged polyelectrolytes for CMP |
Isaac K. Cherian, Phillip W. Carter, Kevin Moeggenborg, David W. Boldridge |
2007-12-11 |
| 6974777 |
CMP compositions for low-k dielectric materials |
Kevin Moeggenborg, Homer Chou, Joseph Hawkins |
2005-12-13 |
| 6936543 |
CMP method utilizing amphiphilic nonionic surfactants |
David Schroeder, Kevin Moeggenborg, Homer Chou, Joseph Hawkins, Phillip W. Carter |
2005-08-30 |
| 6821897 |
Method for copper CMP using polymeric complexing agents |
David Schroeder, Phillip W. Carter, Kyle Miller, Isaac K. Cherian |
2004-11-23 |
| 6776810 |
Anionic abrasive particles treated with positively charged polyelectrolytes for CMP |
Isaac K. Cherian, Phillip W. Carter, Kevin Moeggenborg, David W. Boldridge |
2004-08-17 |
| 6726534 |
Preequilibrium polishing method and system |
Gregory Bogush, Paul M. Feeney, Brian L. Mueller, David Schroeder, Alicia Walters |
2004-04-27 |
| 6612911 |
Alkali metal-containing polishing system and method |
Phillip W. Carter, Gregory Bogush, Francesco M. De Rege, David Schroeder, Brian L. Mueller |
2003-09-02 |
| 6431953 |
CMP process involving frequency analysis-based monitoring |
Phillip W. Carter |
2002-08-13 |
| 6053032 |
System and method for determining a deposition rate in a process stream indicative of a mass build-up and for controlling feed of a product in the process stream to combat same |
Paul R. Kraus, Linda R. Robertson, Barbara E. Moriarty |
2000-04-25 |