Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11936614 | Method and apparatus for sending reply packet, computing device, and storage medium | Jianping Gao | 2024-03-19 |
| 9397068 | Package in package (PiP) electronic device and manufacturing method thereof | Fei Qin, Guofeng Xia, Tong An, Wei Wu, Chengyan Liu | 2016-07-19 |
| 9275941 | Quad flat no lead package and production method thereof | Wei Mu, Zhaoming Xu, Xiaowei Guo | 2016-03-01 |
| 8951840 | FCOC (Flip Chip On Chip) package and manufacturing method thereof | Fei Qin, Guofeng Xia, Tong An, Chengyan Liu, Wei Wu | 2015-02-10 |