Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12374699 | Cathode catalyst layer structure for enhancing durability of catalyst and fabrication method thereof | Junliang Zhang, Zhifeng Zheng, Fengjuan Zhu, Xiaojing Cheng, Guanghua Wei +1 more | 2025-07-29 |
| 9397068 | Package in package (PiP) electronic device and manufacturing method thereof | Fei Qin, Tong An, Wei Wu, Chengyan Liu, Wenhui Zhu | 2016-07-19 |
| 8951840 | FCOC (Flip Chip On Chip) package and manufacturing method thereof | Fei Qin, Tong An, Chengyan Liu, Wei Wu, Wenhui Zhu | 2015-02-10 |