Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9397068 | Package in package (PiP) electronic device and manufacturing method thereof | Fei Qin, Guofeng Xia, Tong An, Wei Wu, Wenhui Zhu | 2016-07-19 |
| 8951840 | FCOC (Flip Chip On Chip) package and manufacturing method thereof | Fei Qin, Guofeng Xia, Tong An, Wei Wu, Wenhui Zhu | 2015-02-10 |