Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11698248 | Device and method for measuring fretting displacement in power cycle of press-pack IGBT | Xueheng Zheng, Rui Zhou, Fei Qin | 2023-07-11 |
| 11699633 | Pressure balancing clamp for press-pack insulated gate bipolar transistor module | Rui Zhou, Yakun Zhang, Fei Qin | 2023-07-11 |
| 11404329 | Device and method for on-line measurement of wafer grinding force | Fei Qin, Lixiang ZHANG, Shuai Zhao, Pei Chen, Yanwei Dai | 2022-08-02 |
| 11251106 | Packaging structure of a SiC MOSFET power module and manufacturing method thereof | Fei Qin, Shuai Zhao, Yanwei Dai, Pei Chen | 2022-02-15 |
| 9397068 | Package in package (PiP) electronic device and manufacturing method thereof | Fei Qin, Guofeng Xia, Wei Wu, Chengyan Liu, Wenhui Zhu | 2016-07-19 |
| 8951840 | FCOC (Flip Chip On Chip) package and manufacturing method thereof | Fei Qin, Guofeng Xia, Chengyan Liu, Wei Wu, Wenhui Zhu | 2015-02-10 |