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Stringer elimination in a BiCMOS process |
Milton Beachy, Thomas Craig Esry, Daniel Charles Kerr, Thomas M. Oberdick |
2010-04-20 |
| 7087498 |
Method for controlling trench depth in shallow trench isolation features |
Milton Beachy, Gerald W. Gibson |
2006-08-08 |
| 6566269 |
Removal of post etch residuals on wafer surface |
Peter Biles, Sylvia Marci Luque, Lauri Monica Nelson, Robert H. Mills |
2003-05-20 |
| 6406999 |
Semiconductor device having reduced line width variations between tightly spaced and isolated features |
Thomas Craig Esry, Nace Layadi, Sylvia Marci Luque, Simon John Molloy |
2002-06-18 |
| 6395639 |
Process for improving line width variations between tightly spaced and isolated features in integrated circuits |
Thomas Craig Esry, Nace Layadi, Sylvia Marci Luque, Simon John Molloy |
2002-05-28 |
| 6136615 |
Migration from control wafer to product wafer particle checks |
Lauri Monica Nelson, Chester Lamar Harris |
2000-10-24 |