Issued Patents All Time
Showing 26–41 of 41 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7204298 | Techniques for microchannel cooling | Marc Scott Hodes, Paul Robert Kolodner, Thomas Nikita Krupenkin, Wonsuck Lee, Todd Richard Salamon +2 more | 2007-04-17 |
| 7095377 | Light-weight signal transmission lines and radio frequency antenna system | Carsten Metz | 2006-08-22 |
| 7048889 | Dynamically controllable biological/chemical detectors having nanostructured surfaces | Susanne Arney, Timofei Nikita Kroupenkine, Mary Louise Mandich, Michael Schabel, Joseph Ashley Taylor | 2006-05-23 |
| 7013452 | Method and apparatus for intra-layer transitions and connector launch in multilayer circuit boards | Torben Baras, Carsten Metz | 2006-03-14 |
| 6724626 | Apparatus for thermal management in a portable electronic device | Marc Scott Hodes | 2004-04-20 |
| 6665127 | Method and apparatus for aligning a photo-tunable microlens | Zhenan Bao, Timofei Nikita Kroupenkine, Mary Louise Mandich, Louis Thomas Manzione, Elsa Reichmanis +1 more | 2003-12-16 |
| 6225571 | Heatsink with high thermal conductivity dielectric | Jeffrey L. Bream, Stephen A. Ferranti, Madhu Ganesa-Pillai, Leon Klafter, John Paul Mello +1 more | 2001-05-01 |
| 6043670 | Method for testing integrated circuits | Yinon Degani | 2000-03-28 |
| 5741430 | Conductive adhesive bonding means | Donald W. Dahringer | 1998-04-21 |
| 5689878 | Method for protecting electronic circuit components | Donald W. Dahringer, Philip Hubbauer, William LAMBERT, Lloyd Shepherd, John D. Weld | 1997-11-25 |
| 5646828 | Thin packaging of multi-chip modules with enhanced thermal/power management | Yinon Degani, Thomas Dixon Dudderar, Byung Joon Han | 1997-07-08 |
| 5608262 | Packaging multi-chip modules without wire-bond interconnection | Yinon Degani, Thomas Dixon Dudderar, Byung Joon Han, King Lien Tai | 1997-03-04 |
| 5365656 | Surface mount assembly of devices using AdCon interconnections | Donald W. Dahringer | 1994-11-22 |
| 5257000 | Circuit elements dependent on core inductance and fabrication thereof | Robert L. Billings, Donald W. Dahringer | 1993-10-26 |
| 4979664 | Method for manufacturing a soldered article | Stephen G. Seger, Jr. | 1990-12-25 |
| 4691091 | Direct writing of conductive patterns | Frederick T. Mendenhall, Jr., Murray Robbins, Nathaniel R. Quick, Cletus W. Wilkins, Jr. | 1987-09-01 |