Ken Lam — 59 Patents at Atmel | Patent Leaderboard

Ken Lam has been granted 59 US patents while listed as an inventor at Atmel. The first was granted in 1986 and the most recent in June 2025. Ken Lam ranks #40,067 of 4,157,543 US inventors in our database (top 0.96%). Patent records list Ken Lam in Walnut, CA, US.

Issued Patents All Time

Showing 1–25 of 59 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
12318175	Patient monitoring system	Marcelo Lamego, Massi Joe E. Kiani, Cristiano Dalvi, Hung Vo	2025-06-03
11925445	Patient monitoring system	Marcelo Lamego, Massi Joe E. Kiani, Cristiano Dalvi, Hung Vo	2024-03-12	$65,300,000
11272852	Patient monitoring system	Marcelo Lamego, Massi Joe E. Kiani, Cristiano Dalvi, Hung Vo	2022-03-15	$30,605,000
11125556	Method and system for monitoring and assessing road conditions	Etienne Coronado	2021-09-21	$147,074,000
9905498	Electronic package	—	2018-02-27
9704812	Double-sided electronic package	—	2017-07-11
9649054	Blood pressure measurement method	Marcelo Lamego, Massi Joe E. Kiani, Cristiano Dalvi, Hung Vo	2017-05-16
9532722	Patient monitoring system	Marcelo Lamego, Massi Joe E. Kiani, Cristiano Dalvi, Hung Vo	2017-01-03	$18,495,000
8860195	Apparatus and method for increasing the quantity of discrete electronic components in an integrated circuit package	—	2014-10-14	$5,106,000
8568822	Apparatus and method incorporating discrete passive components in an electronic package	—	2013-10-29	$6,941,000
8531022	Routable array metal integrated circuit package	—	2013-09-10	$5,806,000
8525329	Component stacking for integrated circuit electronic package	—	2013-09-03	$5,886,000
8487424	Routable array metal integrated circuit package fabricated using partial etching process	—	2013-07-16	$15,730,000
8455304	Routable array metal integrated circuit package fabricated using partial etching process	—	2013-06-04	$34,729,000
8429814	Method of assembling a multi-component electronic package	—	2013-04-30	$13,462,000
8324023	Stacked-die electronics package with planar and three-dimensional inductor elements	—	2012-12-04	$11,589,000
8278150	Stackable packages for three-dimensional packaging of semiconductor dice	—	2012-10-02	$7,064,000
8264075	Stacked-die package including substrate-ground coupling	—	2012-09-11	$8,590,000
8258599	Electronics package with an integrated circuit device having post wafer fabrication integrated passive components	—	2012-09-04	$8,724,000
8237266	Component stacking for integrated circuit electronic package	—	2012-08-07	$6,425,000
8174099	Leadless package with internally extended package leads	—	2012-05-08	$16,436,000
8044526	Integrated circuit assemblies with alignment features and devices and methods related thereto	—	2011-10-25	$10,027,000
8022516	Metal leadframe package with secure feature	Julius Kovats	2011-09-20	$22,170,000
8018065	Wafer-level integrated circuit package with top and bottom side electrical connections	—	2011-09-13	$45,867,000
7981796	Methods for forming packaged products	—	2011-07-19	$19,120,000

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Ken Lam — 59 Patents

Issued Patents All Time

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