Issued Patents All Time
Showing 25 most recent of 59 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12318175 | Patient monitoring system | Marcelo Lamego, Massi Joe E. Kiani, Cristiano Dalvi, Hung Vo | 2025-06-03 |
| 11925445 | Patient monitoring system | Marcelo Lamego, Massi Joe E. Kiani, Cristiano Dalvi, Hung Vo | 2024-03-12 |
| 11272852 | Patient monitoring system | Marcelo Lamego, Massi Joe E. Kiani, Cristiano Dalvi, Hung Vo | 2022-03-15 |
| 11125556 | Method and system for monitoring and assessing road conditions | Etienne Coronado | 2021-09-21 |
| 9905498 | Electronic package | — | 2018-02-27 |
| 9704812 | Double-sided electronic package | — | 2017-07-11 |
| 9649054 | Blood pressure measurement method | Marcelo Lamego, Massi Joe E. Kiani, Cristiano Dalvi, Hung Vo | 2017-05-16 |
| 9532722 | Patient monitoring system | Marcelo Lamego, Massi Joe E. Kiani, Cristiano Dalvi, Hung Vo | 2017-01-03 |
| 8860195 | Apparatus and method for increasing the quantity of discrete electronic components in an integrated circuit package | — | 2014-10-14 |
| 8568822 | Apparatus and method incorporating discrete passive components in an electronic package | — | 2013-10-29 |
| 8531022 | Routable array metal integrated circuit package | — | 2013-09-10 |
| 8525329 | Component stacking for integrated circuit electronic package | — | 2013-09-03 |
| 8487424 | Routable array metal integrated circuit package fabricated using partial etching process | — | 2013-07-16 |
| 8455304 | Routable array metal integrated circuit package fabricated using partial etching process | — | 2013-06-04 |
| 8429814 | Method of assembling a multi-component electronic package | — | 2013-04-30 |
| 8324023 | Stacked-die electronics package with planar and three-dimensional inductor elements | — | 2012-12-04 |
| 8278150 | Stackable packages for three-dimensional packaging of semiconductor dice | — | 2012-10-02 |
| 8264075 | Stacked-die package including substrate-ground coupling | — | 2012-09-11 |
| 8258599 | Electronics package with an integrated circuit device having post wafer fabrication integrated passive components | — | 2012-09-04 |
| 8237266 | Component stacking for integrated circuit electronic package | — | 2012-08-07 |
| 8174099 | Leadless package with internally extended package leads | — | 2012-05-08 |
| 8044526 | Integrated circuit assemblies with alignment features and devices and methods related thereto | — | 2011-10-25 |
| 8022516 | Metal leadframe package with secure feature | Julius Kovats | 2011-09-20 |
| 8018065 | Wafer-level integrated circuit package with top and bottom side electrical connections | — | 2011-09-13 |
| 7981796 | Methods for forming packaged products | — | 2011-07-19 |