Issued Patents All Time
Showing 51–59 of 59 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6376914 | Dual-die integrated circuit package | Julius Kovats | 2002-04-23 |
| 6344401 | Method of forming a stacked-die integrated circuit chip package on a water level | — | 2002-02-05 |
| 6281046 | Method of forming an integrated circuit package at a wafer level | — | 2001-08-28 |
| 5612514 | Tab test device for area array interconnected chips | — | 1997-03-18 |
| 5367763 | TAB testing of area array interconnected chips | — | 1994-11-29 |
| 5249728 | Bumpless bonding process having multilayer metallization | — | 1993-10-05 |
| 5216806 | Method of forming a chip package and package interconnects | — | 1993-06-08 |
| 5177863 | Method of forming integrated leadouts for a chip carrier | — | 1993-01-12 |
| 4612227 | Pressure sensor header | John H. Pond, Douglas W. Wilda | 1986-09-16 |