Issued Patents All Time
Showing 26–50 of 59 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7932590 | Stacked-die electronics package with planar and three-dimensional inductor elements | — | 2011-04-26 |
| 7927918 | Packaged products, including stacked package modules, and methods of forming same | — | 2011-04-19 |
| 7880193 | Method for forming an integral electromagnetic radiation shield in an electronic package | — | 2011-02-01 |
| 7838971 | Method to provide substrate-ground coupling for semiconductor integrated circuit dice constructed from SOI and related materials in stacked-die packages | — | 2010-11-23 |
| 7821122 | Method and system for increasing circuitry interconnection and component capacity in a multi-component package | — | 2010-10-26 |
| 7816769 | Stackable packages for three-dimensional packaging of semiconductor dice | — | 2010-10-19 |
| 7678618 | Methods using die attach paddle for mounting integrated circuit die | — | 2010-03-16 |
| 7638862 | Die attach paddle for mounting integrated circuit die | — | 2009-12-29 |
| 7626247 | Electronic package with integral electromagnetic radiation shield and methods related thereto | — | 2009-12-01 |
| 7564137 | Stackable integrated circuit structures and systems devices and methods related thereto | — | 2009-07-21 |
| 7342308 | Component stacking for integrated circuit electronic package | — | 2008-03-11 |
| 7327030 | Apparatus and method incorporating discrete passive components in an electronic package | — | 2008-02-05 |
| 7323765 | Die attach paddle for mounting integrated circuit die | — | 2008-01-29 |
| 7271031 | Universal interconnect die | Julius Kovats | 2007-09-18 |
| 7239975 | Method and system for automatic stabilization and pointing control of a device | Norman Coleman, George Papanagopoulos, Ching-Fang Lin | 2007-07-03 |
| 7239976 | Method and system for automatic pointing stabilization and aiming control device | Norman Coleman, Ching-Fang Lin | 2007-07-03 |
| 7078792 | Universal interconnect die | Julius Kovats | 2006-07-18 |
| 7064434 | Customized microelectronic device and method for making customized electrical interconnections | Walter Bell | 2006-06-20 |
| 6972486 | Low profile carrier for non-wafer form device testing | Julius Kovats | 2005-12-06 |
| 6762117 | Method of fabricating metal redistribution layer having solderable pads and wire bondable pads | Julius Kovats | 2004-07-13 |
| 6577008 | Metal redistribution layer having solderable pads and wire bondable pads | Julius Kovats | 2003-06-10 |
| 6541284 | Integrated IC chip package for electronic image sensor die | — | 2003-04-01 |
| 6511901 | Metal redistribution layer having solderable pads and wire bondable pads | Julius Kovats | 2003-01-28 |
| 6413799 | Method of forming a ball-grid array package at a wafer level | — | 2002-07-02 |
| 6388335 | Integrated circuit package formed at a wafer level | — | 2002-05-14 |