Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Electronics package with an integrated circuit device having post wafer fabrication integrated passive components

Electronics package with an integrated circuit device having post wafer fabrication integrated passive components

US Patent 8258599 · Granted Sep 4, 2012

Estimated economic value: $8,724,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Patient monitoring system2025
Patient monitoring system2024
Patient monitoring system2022
Method and system for monitoring and assessing road conditions2021
Electronic package2018
Double-sided electronic package2017
Blood pressure measurement method2017
Patient monitoring system2017
Apparatus and method for increasing the quantity of discrete electronic componen2014
Apparatus and method incorporating discrete passive components in an electronic 2013
Routable array metal integrated circuit package2013
Component stacking for integrated circuit electronic package2013