Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9633930 | Method of forming through-hole in silicon substrate, method of forming electrical connection element penetrating silicon substrate and semiconductor device manufactured thereby | Jaegab Lee | 2017-04-25 |
| 8415259 | Method of depositing dielectric film by modified PEALD method | Woo Jin Lee, Kuo-wei Hong, Akira Shimizu | 2013-04-09 |
| 8133555 | Method for forming metal film by ALD using beta-diketone metal complex | Hiroshi Shinriki, Kunitoshi Namba | 2012-03-13 |
| 8084104 | Atomic composition controlled ruthenium alloy film formed by plasma-enhanced atomic layer deposition | Hiroshi Shinriki, Kunitoshi Namba | 2011-12-27 |
| 7655564 | Method for forming Ta-Ru liner layer for Cu wiring | Hiroshi Shinriki | 2010-02-02 |