Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183688 | Integrated circuit die package stiffeners of metal alloys having exceptionally high CTE | Valery Ouvarov-Bancalero, John Harper, Malavarayan Sankarasubramanian, Patrick Nardi, Bamidele Daniel Falola +1 more | 2024-12-31 |
| 9952272 | Fixture for in situ electromigration testing during X-ray microtomography | Nikhilesh Chawla | 2018-04-24 |