CW

Chongyang Wang

Applied Materials: 20 patents #657 of 7,310Top 9%
Huawei: 6 patents #2,214 of 15,535Top 15%
BC Beijing Tsingmicro Intelligent Technology Co.: 1 patents #4 of 16Top 25%
SC Sanechips Technology Co.: 1 patents #59 of 244Top 25%
SC Sokudo Co.: 1 patents #34 of 74Top 50%
📍 Saratoga, CA: #319 of 2,933 inventorsTop 15%
🗺 California: #16,431 of 386,348 inventorsTop 5%
Overall (All Time): #115,504 of 4,157,543Top 3%
31
Patents All Time

Issued Patents All Time

Showing 26–31 of 31 patents

Patent #TitleCo-InventorsDate
7357842 Cluster tool architecture for processing a substrate Tetsuya Ishikawa, Rick J. Roberts, Helen R. Armer, Leon Volfovski, Jay D. Pinson, II +10 more 2008-04-15
6580955 Apparatus, method and medium for enhancing the throughput of a wafer processing facility using a multi-slot cool down chamber and a priority transfer scheme Zhihong Lin 2003-06-17
6449520 Apparatus, method and medium for enhancing the throughput of a wafer processing facility using a multi-slot cool down chamber and a priority transfer scheme Zhihong Lin 2002-09-10
6360132 Apparatus, method and medium for enhancing the throughput of a wafer processing facility using a multi-slot cool down chamber and a priority transfer scheme Zhihong Lin 2002-03-19
6201998 Apparatus, method and medium for enhancing the throughput of a wafer processing facility using a multi-slot cool down chamber and a priority transfer scheme Zhihong Lin 2001-03-13
5975740 Apparatus, method and medium for enhancing the throughput of a wafer processing facility using a multi-slot cool down chamber and a priority transfer scheme Zhihong Lin 1999-11-02