AC

Andrew Conners

Applied Materials: 3 patents #2,994 of 7,310Top 45%
Overall (All Time): #1,620,801 of 4,157,543Top 40%
3
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
6190233 Method and apparatus for improving gap-fill capability using chemical and physical etchbacks Soonil Hong, Choon Kun Ryu, Michael P. Nault, Kaushal K. Singh, Anthony Lam +1 more 2001-02-20
6191026 Method for submicron gap filling on a semiconductor substrate Virendra V. Rana, Anand Gupta, Xin Sheng Guo, Soonil Hong 2001-02-20
5990000 Method and apparatus for improving gap-fill capability using chemical and physical etchbacks Soonil Hong, Choon Kun Ryu, Michael P. Nault, Kaushal K. Singh, Anthony Lam +1 more 1999-11-23