Robert O. Conn — 71 Patents at AMD

Robert O. Conn has been granted 71 US patents while listed as an inventor at AMD. The first was granted in 1997 and the most recent in June 2014. Robert O. Conn ranks #28,405 of 4,157,543 US inventors in our database (top 0.68%). Patent records list Robert O. Conn in Los Gatos, CA, US.

Issued Patents All Time

Showing 1–25 of 71 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
8742700	Accelerator having acceleration channels formed between covalently bonded chips	Kim L. Hailey	2014-06-03
8680792	Accelerator having acceleration channels formed between covalently bonded chips	Kim L. Hailey	2014-03-25
8671560	In system reflow of low temperature eutectic bond balls	Daniel S. Stevenson	2014-03-18
8648315	Accelerator having a multi-channel micro-collimator	Kim L. Hailey	2014-02-11
8564225	Accelerator on a chip having a grid and plate cell	Kim L. Hailey	2013-10-22
8541757	Accelerator on a chip having a cold ion source	Kim L. Hailey	2013-09-24
8541884	Through-substrate via having a strip-shaped through-hole signal conductor	David F. Myers, Daniel S. Stevenson	2013-09-24
8519644	Accelerator having acceleration channels formed between covalently bonded chips	Kim L. Hailey	2013-08-27
8404585	Preventing breakage of long metal signal conductors on semiconductor substrates	—	2013-03-26
8222086	Integrated semiconductor substrate structure using incompatible processes	—	2012-07-17
8129834	Integral metal structure with conductive post portions	—	2012-03-06
8099691	Disabling unused/inactive resources in an integrated circuit for static power reduction	Tim Tuan, Kameswara K. Rao	2012-01-17	$8,414,000
8062968	Interposer for redistributing signals	—	2011-11-22	$4,107,000
8008134	Large substrate structural vias	—	2011-08-30
7999388	Preventing breakage of long metal signal conductors on semiconductor substrates	—	2011-08-16
7978029	Multiple-layer signal conductor	—	2011-07-12
7944041	Integrated semiconductor substrate structure using incompatible processes	—	2011-05-17
7829994	Semiconductor substrate elastomeric stack	—	2010-11-09
7831874	Local defect memories on semiconductor substrates in a stack computer	—	2010-11-09
7764498	Comb-shaped power bus bar assembly structure having integrated capacitors	—	2010-07-27
7719844	Stackable self-aligning insulative guide tray for holding semiconductor substrates	—	2010-05-18
7709966	Large substrate structural vias	—	2010-05-04
7667473	Flip-chip package having thermal expansion posts	Steven J. Carey	2010-02-23	$3,687,000
7581124	Method and mechanism for controlling power consumption of an integrated circuit	Neil G. Jacobson, Matthew T. Murphy, Tim Tuan, Kameswara K. Rao	2009-08-25	$24,447,000
7566960	Interposing structure	—	2009-07-28	$9,789,000

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Robert O. Conn — 71 Patents

Issued Patents All Time

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