Issued Patents All Time
Showing 25 most recent of 71 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8742700 | Accelerator having acceleration channels formed between covalently bonded chips | Kim L. Hailey | 2014-06-03 |
| 8680792 | Accelerator having acceleration channels formed between covalently bonded chips | Kim L. Hailey | 2014-03-25 |
| 8671560 | In system reflow of low temperature eutectic bond balls | Daniel S. Stevenson | 2014-03-18 |
| 8648315 | Accelerator having a multi-channel micro-collimator | Kim L. Hailey | 2014-02-11 |
| 8564225 | Accelerator on a chip having a grid and plate cell | Kim L. Hailey | 2013-10-22 |
| 8541757 | Accelerator on a chip having a cold ion source | Kim L. Hailey | 2013-09-24 |
| 8541884 | Through-substrate via having a strip-shaped through-hole signal conductor | David F. Myers, Daniel S. Stevenson | 2013-09-24 |
| 8519644 | Accelerator having acceleration channels formed between covalently bonded chips | Kim L. Hailey | 2013-08-27 |
| 8404585 | Preventing breakage of long metal signal conductors on semiconductor substrates | — | 2013-03-26 |
| 8222086 | Integrated semiconductor substrate structure using incompatible processes | — | 2012-07-17 |
| 8129834 | Integral metal structure with conductive post portions | — | 2012-03-06 |
| 8099691 | Disabling unused/inactive resources in an integrated circuit for static power reduction | Tim Tuan, Kameswara K. Rao | 2012-01-17 |
| 8062968 | Interposer for redistributing signals | — | 2011-11-22 |
| 8008134 | Large substrate structural vias | — | 2011-08-30 |
| 7999388 | Preventing breakage of long metal signal conductors on semiconductor substrates | — | 2011-08-16 |
| 7978029 | Multiple-layer signal conductor | — | 2011-07-12 |
| 7944041 | Integrated semiconductor substrate structure using incompatible processes | — | 2011-05-17 |
| 7829994 | Semiconductor substrate elastomeric stack | — | 2010-11-09 |
| 7831874 | Local defect memories on semiconductor substrates in a stack computer | — | 2010-11-09 |
| 7764498 | Comb-shaped power bus bar assembly structure having integrated capacitors | — | 2010-07-27 |
| 7719844 | Stackable self-aligning insulative guide tray for holding semiconductor substrates | — | 2010-05-18 |
| 7709966 | Large substrate structural vias | — | 2010-05-04 |
| 7667473 | Flip-chip package having thermal expansion posts | Steven J. Carey | 2010-02-23 |
| 7581124 | Method and mechanism for controlling power consumption of an integrated circuit | Neil G. Jacobson, Matthew T. Murphy, Tim Tuan, Kameswara K. Rao | 2009-08-25 |
| 7566960 | Interposing structure | — | 2009-07-28 |