Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7667473 | Flip-chip package having thermal expansion posts | Robert O. Conn | 2010-02-23 |
| 7362121 | Self-heating mechanism for duplicating microbump failure conditions in FPGAs and for logging failures | Robert O. Conn, Siuki Chan, William H. Pabst | 2008-04-22 |
| 6961231 | Interposer providing low-inductance decoupling capacitance for a packaged integrated circuit | Mark A. Alexander, Robert O. Conn | 2005-11-01 |
| 6891258 | Interposer providing low-inductance decoupling capacitance for a packaged integrated circuit | Mark A. Alexander, Robert O. Conn | 2005-05-10 |
| 4741661 | Wheel lifting and towing apparatus | — | 1988-05-03 |