Issued Patents All Time
Showing 26–37 of 37 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6465889 | Silicon carbide barc in dual damascene processing | Ramkumar Subramanian, Fei Wang, Calvin T. Gabriel, Darrell M. Erb | 2002-10-15 |
| 6451673 | Carrier gas modification for preservation of mask layer during plasma etching | Calvin T. Gabriel | 2002-09-17 |
| 6448654 | Ultra thin etch stop layer for damascene process | Calvin T. Gabriel | 2002-09-10 |
| 6444573 | Method of making a slot via filled dual damascene structure with a middle stop layer | Fei Wang, Ramkumar Subramanian, Calvin T. Gabriel | 2002-09-03 |
| 6429116 | Method of fabricating a slot dual damascene structure without middle stop layer | Fei Wang, Ramkumar Subramanian, Calvin T. Gabriel | 2002-08-06 |
| 6391766 | Method of making a slot via filled dual damascene structure with middle stop layer | Fei Wang, Ramkumar Subramanian, Calvin T. Gabriel | 2002-05-21 |
| 6383919 | Method of making a dual damascene structure without middle stop layer | Fei Wang, Ramkumar Subramanian, Calvin T. Gabriel | 2002-05-07 |
| 6372635 | Method for making a slot via filled dual damascene low k interconnect structure without middle stop layer | Fei Wang, Ramkumar Subramanian, Calvin T. Gabriel | 2002-04-16 |
| 6372631 | Method of making a via filled dual damascene structure without middle stop layer | Fei Wang, Ramkumar Subramanian, Calvin T. Gabriel | 2002-04-16 |
| 6365505 | Method of making a slot via filled dual damascene structure with middle stop layer | Fei Wang, Ramkumar Subramanian, Calvin T. Gabriel | 2002-04-02 |
| 6340395 | Salsa clean process | Jacques Bertrand, Barry Earl Dick, Shu Tsai Wang, Weiwen Ou, Yen-Chia Chu | 2002-01-22 |
| 6309955 | Method for using a CVD organic barc as a hard mask during via etch | Ramkumar Subramanian, Fei Wang, Todd P. Lukanc | 2001-10-30 |