Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11631624 | Semiconductor chip package with spring biased lid | William J. Maxwell | 2023-04-18 |
| 10312221 | Stacked dies and dummy components for improved thermal performance | Rahul Agarwal, Milind S. Bhagavat, Brett P. Wilkerson | 2019-06-04 |
| 9780067 | Semiconductor chip metal alloy thermal interface material | Daniel Cavasin | 2017-10-03 |