Issued Patents All Time
Showing 26–30 of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8569169 | Bottom source power MOSFET with substrateless and manufacturing method thereof | Yueh-Se Ho, Yan Xun Xue | 2013-10-29 |
| 8563361 | Packaging method of molded wafer level chip scale package (WLCSP) | Yan Xun Xue, Hamza Yilmaz, Yueh-Se Ho, Jun Lu, Lei Shi +2 more | 2013-10-22 |
| 8564110 | Power device with bottom source electrode | Yan Xun Xue, Yueh-Se Ho, Hamza Yilmaz, Jun Lu, Lei Shi +1 more | 2013-10-22 |
| 8486803 | Wafer level packaging method of encapsulating the bottom and side of a semiconductor chip | Ruisheng Wu, Lei Duan, Yi-Yi Chen, Yuping Gong | 2013-07-16 |
| 6946335 | Method of manufacturing improved double-diffused metal-oxide-semiconductor device with self-aligned channel | Hiu Ip, Ellick Ma | 2005-09-20 |