Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9245861 | Wafer process for molded chip scale package (MCSP) with thick backside metallization | Yan Xun Xue, Hamza Yilmaz, Yueh-Se Ho, Jun Lu, Zhiqiang Niu +2 more | 2016-01-26 |