Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9337131 | Power semiconductor device and the preparation method | Yan Huo, Hamza Yilmaz, Jun Lu, Ming-Chen Lu, Zhi Qiang Niu +1 more | 2016-05-10 |
| 8159828 | Low profile flip chip power module and method of making | Ming Sun | 2012-04-17 |
| 7466014 | Flip chip mounted semiconductor device package having a dimpled leadframe | Ming Sun | 2008-12-16 |
| 7202113 | Wafer level bumpless method of making a flip chip mounted semiconductor device package | Ming Sun | 2007-04-10 |