Issued Patents All Time
Showing 26–29 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6921968 | Stacked flip chip package | — | 2005-07-26 |
| 6673656 | Semiconductor chip package and manufacturing method thereof | — | 2004-01-06 |
| 6201299 | Substrate structure of BGA semiconductor package | Su Tao, Jian-Cheng Chen, Chun-Chi Lee | 2001-03-13 |
| 6150730 | Chip-scale semiconductor package | Kuo-Pin Yang, Jen-Kuang Fang, Su Tao | 2000-11-21 |