Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8357998 | Wirebonded semiconductor package | Wen-Pin Huang, Cheng Lan Tseng, Chih-Cheng Hung, Yu-Chi Chen | 2013-01-22 |
| 8053906 | Semiconductor package and method for processing and bonding a wire | Hsiao-Chuan Chang, Tsung-Yueh Tsai, Yi-Shao Lai, Ho-Ming Tong, Jian-Cheng Chen +3 more | 2011-11-08 |