Issued Patents All Time
Showing 26–50 of 171 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11925881 | Method and apparatus for cleaning substrates using high temperature chemicals and ultrasonic device | Fuping Chen, Hui Wang, Xi Wang, Shena Jia, Danying Wang +2 more | 2024-03-12 |
| 11911808 | System for cleaning semiconductor wafers | Hui Wang, Fufa Chen, Fuping Chen, Xi Wang, Xiaoyan Zhang +5 more | 2024-02-27 |
| 11859303 | Plating apparatus | Zhaowei Jia, Hongchao Yang, Chenhua Lu, Hui Wang | 2024-01-02 |
| 11848217 | Methods and apparatus for cleaning substrates | Hui Wang, Xi Wang, Fuping Chen, Fufa Chen, Xiaoyan Zhang +4 more | 2023-12-19 |
| 11819381 | Dental implant system with surface gradient microporous structure and a preparation method thereof | Xiaohui Wang, Liyuan SHENG | 2023-11-21 |
| 11781235 | Plating apparatus and plating method | Yinuo Jin, Hongchao Yang, Hui Wang | 2023-10-10 |
| 11777472 | Bulk acoustic wave resonator | Guojun Weng | 2023-10-03 |
| 11757427 | Bulk acoustic wave filter having release hole and fabricating method of the same | — | 2023-09-12 |
| 11752529 | Method for cleaning semiconductor wafers | Hui Wang, Fufa Chen, Fuping Chen, Xi Wang, Xiaoyan Zhang +5 more | 2023-09-12 |
| 11683020 | Chip packaging method and particle chips | — | 2023-06-20 |
| 11677381 | Film bulk acoustic resonator structure and fabricating method | — | 2023-06-13 |
| 11667104 | Multilayer film with reversible haze | Rou Hua Chua, Wu Aik Yee, Bee Tin Low, Muthu Subramanian, Yutaka Maehara | 2023-06-06 |
| 11649357 | Laser platable thermoplastic compositions with good flame retardancy, high heat property and good ductility and shaped articles made therefrom | Shijie Song | 2023-05-16 |
| 11652460 | Method of manufacturing bulk acoustic wave resonator | — | 2023-05-16 |
| 11643586 | Thermally conductive thermoplastic compositions with good dielectric property and the shaped article therefore | Shijie Song, Yaqin Zhang | 2023-05-09 |
| 11638937 | Methods and apparatus for cleaning substrates | Hui Wang, Xi Wang, Fuping Chen, Fufa Chen, Xiaoyan Zhang +4 more | 2023-05-02 |
| 11633765 | System for cleaning semiconductor wafers | Hui Wang, Fufa Chen, Fuping Chen, Xi Wang, Xiaoyan Zhang +5 more | 2023-04-25 |
| 11616489 | Bulk acoustic wave filter having release hole and fabricating method of the same | — | 2023-03-28 |
| 11616044 | Chip packaging method and particle chips | — | 2023-03-28 |
| 11581205 | Methods and system for cleaning semiconductor wafers | Hui Wang, Fufa Chen, Fuping Chen, Xi Wang, Xiaoyan Zhang +5 more | 2023-02-14 |
| 11581867 | Bulk acoustic wave filter and manufacturing method thereof, communication device | — | 2023-02-14 |
| 11545958 | FBAR structure having single crystalline piezoelectric layer and fabricating method thereof | — | 2023-01-03 |
| 11533039 | Lithium niobate or lithium tantalate FBAR structure and fabricating method thereof | — | 2022-12-20 |
| 11518880 | Thermoplastic polycarbonate compositions with improved hydrolytic stability and electrical tracking resistance and shaped articles thereof | Xing Liu, Wei Shan | 2022-12-06 |
| 11469134 | Plating chuck | Hui Wang, Zhaowei Jia, Hongchao Yang | 2022-10-11 |