Issued Patents All Time
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11967497 | Methods and apparatus for cleaning semiconductor wafers | Jun Wang, Hui Wang, Fufa Chen, Fuping Chen, Jian Wang +5 more | 2024-04-23 |
| 11926920 | Electroplating apparatus and electroplating method | Jian Wang, Hui Wang, Hongchao Yang | 2024-03-12 |
| 11911808 | System for cleaning semiconductor wafers | Hui Wang, Fufa Chen, Fuping Chen, Jian Wang, Xi Wang +5 more | 2024-02-27 |
| 11859303 | Plating apparatus | Hongchao Yang, Chenhua Lu, Jian Wang, Hui Wang | 2024-01-02 |
| 11848217 | Methods and apparatus for cleaning substrates | Hui Wang, Xi Wang, Fuping Chen, Fufa Chen, Jian Wang +4 more | 2023-12-19 |
| 11752529 | Method for cleaning semiconductor wafers | Hui Wang, Fufa Chen, Fuping Chen, Jian Wang, Xi Wang +5 more | 2023-09-12 |
| 11638937 | Methods and apparatus for cleaning substrates | Hui Wang, Xi Wang, Fuping Chen, Fufa Chen, Jian Wang +4 more | 2023-05-02 |
| 11633765 | System for cleaning semiconductor wafers | Hui Wang, Fufa Chen, Fuping Chen, Jian Wang, Xi Wang +5 more | 2023-04-25 |
| 11581205 | Methods and system for cleaning semiconductor wafers | Hui Wang, Fufa Chen, Fuping Chen, Jian Wang, Xi Wang +5 more | 2023-02-14 |
| 11469134 | Plating chuck | Hui Wang, Jian Wang, Hongchao Yang | 2022-10-11 |
| 11257667 | Methods and apparatus for cleaning semiconductor wafers | Jun Wang, Hui Wang, Fufa Chen, Fuping Chen, Jian Wang +5 more | 2022-02-22 |
| 11141762 | System for cleaning semiconductor wafers | Hui Wang, Fufa Chen, Fuping Chen, Jian Wang, Xi Wang +5 more | 2021-10-12 |
| 11103898 | Methods and apparatus for cleaning substrates | Hui Wang, Xi Wang, Fuping Chen, Fufa Chen, Jian Wang +4 more | 2021-08-31 |
| 11037804 | Methods and apparatus for cleaning substrates | Hui Wang, Xi Wang, Fuping Chen, Fufa Chen, Jian Wang +4 more | 2021-06-15 |
| 11008669 | Apparatus for holding a substrate | Hui Wang, Hongchao Yang, Jun Wu, Jian Wang | 2021-05-18 |
| 10910244 | Methods and system for cleaning semiconductor wafers | Hui Wang, Fufa Chen, Fuping Chen, Jian Wang, Xi Wang +5 more | 2021-02-02 |
| 10615073 | Method for removing barrier layer for minimizing sidewall recess | Jian Wang, Hui Wang | 2020-04-07 |
| 10453743 | Barrier layer removal method and semiconductor structure forming method | Dongfeng Xiao, Jian Wang, Hui Wang | 2019-10-22 |
| 10217662 | Method for processing interconnection structure for minimizing barrier sidewall recess | Jian Wang, Hui Wang | 2019-02-26 |
| 10020208 | Methods and apparatus for cleaning semiconductor wafers | Jian Wang, Sunny Voha Nuch, Liangzhi Xie, Junping Wu, Yunwen Huang +2 more | 2018-07-10 |
| 9633833 | Methods and apparatus for cleaning semiconductor wafers | Jian Wang, Sunny Voha Nuch, Liangzhi Xie, Junping Wu, Yunwen Huang +3 more | 2017-04-25 |
| 9595457 | Methods and apparatus for cleaning semiconductor wafers | Jian Wang, Sunny Voha Nuch, Liangzhi Xie, Junping Wu, Yunwen Huang +2 more | 2017-03-14 |
| 9492852 | Methods and apparatus for cleaning semiconductor wafers | Jian Wang, Sunny Voha Nuch, Liangzhi Xie, Junping Wu, Yunwen Huang +3 more | 2016-11-15 |
| 9496172 | Method for forming interconnection structures | Jian Wang, Hui Wang | 2016-11-15 |
| 8598039 | Barrier layer removal method and apparatus | Jian Wang, Junping Wu, Liangzhi Xie, Hui Wang | 2013-12-03 |