Issued Patents 2025
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12414243 | Manufacturing method of package structure | Chen-Hao Lin, Cheng-Ta Ko, John Hon-Shing Lau, Yu-Hua Chen, Tzyy-Jang Tseng | 2025-09-09 |
| 12369250 | Circuit board structure and manufacturing method thereof | Ping-Tsung Lin, Chia-Yu Peng, Pu-Ju Lin, Cheng-Ta Ko | 2025-07-22 |
| 12300844 | Battery module | Yuwen Wang, Guangliang LIN | 2025-05-13 |
| 12266616 | Integrated circuit package structure | Chia-Yu Peng, John Hon-Shing Lau | 2025-04-01 |
| 12255279 | Light-emitting diode package structure and manufacturing method thereof | Wen-Yu Lin | 2025-03-18 |
| 12218017 | Glass carrier having protection structure and manufacturing method thereof | Wen-Yu Lin, Pu-Ju Lin | 2025-02-04 |