Issued Patents 2025
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412879 | Package structure and manufacturing method thereof | Tzyy-Jang Tseng | 2025-09-09 |
| 12414243 | Manufacturing method of package structure | Kai-Ming Yang, Chen-Hao Lin, Cheng-Ta Ko, Yu-Hua Chen, Tzyy-Jang Tseng | 2025-09-09 |
| 12309943 | Circuit carrier and manufacturing method thereof and package structure | Ra-Min Tain, Cheng-Ta Ko, Tzyy-Jang Tseng, Chun-Hsien Chien | 2025-05-20 |
| 12266616 | Integrated circuit package structure | Kai-Ming Yang, Chia-Yu Peng | 2025-04-01 |
| 12243838 | Circuit substrate structure and manufacturing method thereof | Tzyy-Jang Tseng, Pu-Ju Lin, Cheng-Ta Ko | 2025-03-04 |